Helios™ features new patented technology that gives it the ability to process deep holes without the use of internal coolant supply. State-of-the-art flute design improves chip evacuation, making it feasible to drill up to 20xD without pecking. Patented thinning reduces thrust by nearly 50% when compared to the competition during testing. By utilizing OSG's WXL® coating, Helios™ can handle a wide range of materials with up to three times greater wear resistance versus conventional coatings.
Print
