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Introducing FaradFlex® : ENHANCING SPEED AND PERFORMANCE, ONE LAYER AT A TIME

When ultra-thin laminate, low impedance, low inductance and high capacitance are needed, FaradFlex® is the solution! Increase your speed while reducing impedance, power bus noise and EMI. Embed Capacitor Layers inside your PCB or Chip Package. See the cost benefits of optimizing space and performance. Reduce overall costs by eliminating the need for many capacitors and the valuable PCB space they occupy.

To start enjoying the benefits of Buried Capacitance technology using the FaradFlex line of products contact Oak-Mitsui Technologies.

FaradFlex® has been the solution for a number of applications such as network servers, routers and switches, data storage, supercomputers and is expanding in the areas of cell phones, RF modules, automotive and aerospace controls, satellite and antennae systems, and medical devices. Oak Mitsui Technologies offers a full range of FaradFlex® products to fit all of your embedded capacitor needs.

BENEFITS OF BURIED CAPACITANCE™

» Reduction in Discrete Capacitors and their associated vias

» Reduced PCB size and/or increased functionality

» Reduced PCB thickness

» Reduced Design Issues/Improved Time to Market

» Improved Power Distribution System

» Improved EMC/EMI

FEATURES OF FARADFLEX®

» Robust Product that is Compatible with Standard PCB Processes

» Highest Capacitance Density and Thinnest Products Available

» 100% High Potential (Hi-Pot) Tested

» Compatible with Lead-Free Assembly

Find out why you should use FARADFLEX®

To start enjoying the benefits of Buried Capacitance technology using the FaradFlex line of products contact Oak-Mitsui Technologies:

• Phone: (518) 686-4961
• Fax: (518) 686-8095
• FaradFlex.Sales@oakmitsui.com

Visit us at www.faradflex.com