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Oak-Mitsui, Inc. - Low Profile Copper Foil - MicroThin®

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Designers and fabricators are always arguing about how to reduce track width and increase reliability of the circuitry. One effective solution is MicroThin®.

MicroThin® is a very low profile copper 3µm or 5µm copper foil with an 18µm or 35µm peelable copper carrier for high-density circuit applications. The releasing layer can be peeled-off after lamination and recycled.

The Benefits of MicroThin® include:

  • Easy to release carrier after high temperature lamination
  • Uniform thickness of ultra thin foil
  • Ease in handling super thin copper foil
  • Protection from defects during shipping and lamination
  • Very fine circuit pattern production
  • Sufficient peel strength

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