Product Announcement from Quist Electronics


Bergquist Gap Pad 1000SF-Image

Thermally Conductive, Silicone-Free Gap Filling Material

Features and Benefits

  • Thermal conductivity: 0.9 W/m-K
  • No silicone outgassing
  • No silicone extraction
  • Reduced tack on one side to aid in application assembly
  • Electrically isolating

The new Gap Pad 1000SF is a thermally conductive, electrically insulating, siliconefree polymer specially designed for silicone-sensitive applications.The material is ideal for applications with high standoff and flatness tolerances. Gap Pad 1000SF is reinforced for easy material handling and added durability during assembly.The material is available with a protective liner on both sides of the material.The topside has reduced tack for ease of handling.

Note: Resultant thickness is defined as the final gap thickness of the application.

Typical Applications Include:

  • Digital disk drives / CD-ROM
  • Automotive modules
  • Fiber optics modules

Configurations Available:

  • Sheet form
  • Die-cut parts
 
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