Bergquist Hi-Flow 330P Thermal Conductive Material

Product Announcement from Quist Electronics

Bergquist Hi-Flow 330P Thermal Conductive Material-Image

The Bergquist Company announces the latest addition to its family of thermally conductive phase change materials.

• Thermal impedance: 0.18°C-in2/W (@25 psi)
• Natural tack for ease of assembly
• Exceptional thermal performance in an insulated pad

Hi-Flow 330P is a thermally conductive phase change material featuring a natural tack on one side and reinforced with a polyimide film. The polyimide film provides a high dielectric strength and cut through resistance. Hi-Flow 330P offers excellent handling and consistent liner peel-off characteristics. The material is designed for use between a high power electronic component requiring electrical isolation and its heat sink. Hi-flow 330P's thermal performance is exceptional with a thermal impedance of 0.17ºC-in²/W at 50 psi. Bergquist recommends the use clips or springs for phase change materials to assure constant pressure between the component interface and the heat sink.

Contact us for further information, or view all Bergquist parts.