Bergquist Hi-Flow 330P Thermal Conductive Material
Product Announcement from Quist Electronics
The Bergquist Company announces the latest addition to its family of thermally conductive phase change materials.
• Thermal impedance: 0.18°C-in2/W (@25 psi)
• Natural tack for ease of assembly
• Exceptional thermal performance in an insulated pad
Hi-Flow 330P is a thermally conductive phase change material featuring a natural tack on one side and reinforced with a polyimide film. The polyimide film provides a high dielectric strength and cut through resistance. Hi-Flow 330P offers excellent handling and consistent liner peel-off characteristics. The material is designed for use between a high power electronic component requiring electrical isolation and its heat sink. Hi-flow 330P's thermal performance is exceptional with a thermal impedance of 0.17ºC-in²/W at 50 psi. Bergquist recommends the use clips or springs for phase change materials to assure constant pressure between the component interface and the heat sink.