Product Announcement from Quist Electronics
The true workhorse of the Sil-Pad product family, Sil-Pad 900S thermally conductive insulation material, is designed for a wide variety of applications requiring high thermal performance and electrical isolation.These applications also typically have low mounting pressures for component clamping.
Sil-Pad 900S material combines a smooth and highly compliant surface characteristic with high thermal conductivity.These features optimize the thermal resistance properties at low pressures.
Applications requiring low component clamping forces include discrete semiconductors (TO-220,TO-247 and TO-218) mounted with spring clips. Spring clips assist with quick assembly and apply a limited amount of force to the semiconductor.The smooth surface texture of Sil-Pad 900S minimizes interfacial thermal resistance and maximizes thermal performance.
Features and Benefits
- Thermal impedance: 0.61°C-in2/W (@50 psi)
- Electrically isolating
- Low mounting pressures
- Smooth and highly compliant surface
- General-purpose thermal interface material solution
Typical Applications Include:
- Power supplies
- Automotive electronics
- Motor controls
- Power semiconductors
- Sheet form, die-cut parts and roll form
- With or without pressure sensitive adhesive