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MFM65 Process XRR, XRF, and XRD metrology FAB tool

Product Announcement from Rigaku Corporation

MFM65 Process XRR, XRF, and XRD metrology FAB tool-Image

The Rigaku MFM65 performs high-precision measurements not possible by optical or ultrasonic techniques. This sophisticated X-ray metrology tool makes it practical to perform high-throughput measurements on product and blanket wafers ranging from ultrathin single-layer films to multilayer stacks.

Designed for high-volume manufacturing

The MFM65 is designed with high-volume 200mm and 300mm manufacturing in mind: high-throughput thickness measurement by XRR and XRF, low-contamination wafer handling and pattern recognition-based position control for product wafer measurements, CE Marking and S2/S8 Compliance for semiconductor production clean room operation, compliance with GEM-300/HSMS and factory automation standards, high-reliability machine performance and low power consumption and cost of ownership.

COLORS™ enabling technology

COLORS™ X-ray optics were developed by Rigaku for the MFM65 to enable measurements from small areas. COLORS beam modules couple a variety of XRF excitation sources with optics and are optimized to provide high brightness in small spots for a variety of thin film applications. With its own x-ray optics business, Rigaku is well-positioned develop and manufacture X-ray sources for current and future market needs.


  • Micro-XRR: film thickness, density, and roughness measurement
  • Micro-XRF: film thickness and composition measurement
  • Micro-XRD: phase, crystallinity, and preferred orientation evaluation
  • Thickness measurement of ultrathin films from 1nm
  • Multilayer dielectric film measurement by XRR
  • Multilayer metal film measurement by XRF
  • Multilayer metal film measurement by XRF
  • Evaluation of crystallinity and preferred crystal orientation by XRD