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Rogue Valley Microdevices, Inc. - 50mm-300mm Silicon Wafer Supplier for Thin Films
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Because of our ability to process all wafers diameters (50mm-300mm) Rogue Valley Microdevices maintains a diverse inventory for customers whom require either bare silicon wafers or silicon wafers with Thin Films. Our ability to provide you with both thin films services and the silicon wafers can help reduce cycle time as well as shipping cost.
Click here to learn more about our Silicon Wafer Capabilities and Specifications....
Contact Us:
- Email us for specific application and capability questions - we are here to help!
- Request a Price Quotation...
Below is a list of thin films that Rogue Valley Microdevices offers. We are able to process silicon wafers, SOI Wafers, and Solar Wafers. If you do not see a film listed that you require please contact us. We are continually adding films to meet our customer's requirements. We have a highly experienced engineering, and technical sales team that are available to assist you.
Quick Capability Links:
- Wet Thermal Oxidation
- Dry Thermal Oxidation
- Dry Chlorinated Thermal Oxidation
- Thermal Annealing
- Stoichiometric LPCVD Nitride
- Low Stress LPCVD Nitride
- Super Low Stress LPCVD Nitride
- Targeted Stress LPCVD Nitride
- PECVD Oxide/PECVD Carbon Doped Oxide
- PECVD OxyNitride
- PECVD Nitride/PECVD Low Stress Nitride
- PECVD Silicon Carbide
About Rogue Valley Microdevices, Inc.:
Founded in 2003, Rogue Valley Microdevices is the first company to establish a microelectronics manufacturing facility in beautiful Southern Oregon. Headquartered in Medford Oregon, we have quickly established ourselves as one of the premier Thin Films Foundries in the United States by providing our customers with great quality, customer service, and engineering support.
Our manufacturing facility contains processing equipment capable of volume manufacturing yet flexible enough to accommodate wafer sizes from 50mm to 300mm. We offer a variety of processes, including Low Stress LPCVD Nitride, PECVD Oxide, PECVD Nitride, PECVD Silicon Carbide, Thermal Oxidation, Chlorinated Oxidation, N2/H2 Annealing, and Sputtered Metals to satisfy our customers' needs.
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