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Rogue Valley Microdevices, Inc. - Dry Thermal Oxide available for Silicon Wafers

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Rogue Valley Microdevices offers Dry Thermal Oxide. Our ultra pure Dry Oxidation process is available for those applications requiring thinner oxides. We offer Chlorinated and Non-Clorinated Dry Thermal Oxide. Using Dry Chlorinated Thermal Oxide can help your devices perform to their highest potential by eliminating metal ions.

We also offer the opportunity to customize our standard process to meet your needs. In many cases the temperature, ramp rates and gas flows can be modified to achieve the result you are looking for.

We also carry a wide selection of bare silicon wafers for your convenience.

Rogue Valley Microdevices offers the following Thermal processing:

  • Wet Thermal Oxidation
  • Dry Thermal Oxidation
  • Dry Chlorinated Thermal Oxidation
  • N2, N2/O2 Anneal
  • Forming Gas Anneal

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About Rogue Valley Microdevices, Inc.: Founded in 2003, Rogue Valley Microdevices is the first company to establish a microelectronics manufacturing facility in beautiful Southern Oregon. Headquartered in Medford Oregon, we have quickly established ourselves as one of the premier Thin Films Foundries in the United States by providing our customers with great quality, customer service, and engineering support. Our manufacturing facility contains processing equipment capable of volume manufacturing yet flexible enough to accommodate wafer sizes from 50mm to 200mm. We offer a variety of processes, including Low Stress LPCVD Nitride, PECVD Oxide, PECVD Nitride, PECVD Silicon Carbide, Thermal Oxidation, Chlorinated Oxidation, N2/H2 Annealing, and a variety of Metal films to satisfy our customers' needs.

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