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Rogue Valley Microdevices, Inc. - Nitrogen Annealing Available including Forming Gas
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Rogue Valley Microdevices offers Nitrogen, Nitrogen/Oxygen, and Forming Gas Annealing.
Nitrogen Annealing after PECVD deposition can be important if wafers are exposed to high temperatures later on in the process. Adding an Anneal will densify PECVD films to make them more stable during thermal cycling.
We recommend adding a Forming Gas Anneal after Dry Chlorinated oxidation to passivate dangling bonds. Dangling bonds at the silicon interface can have an effect on the insulating properties of your oxide. Adding a Forming Gas Anneal will insure that you are the receiving the maximum benefit of your Dry Chlorinated Oxide.
Contact Us:
- Email us for specific application and capability questions - we are here to help!
- Request a Price Quotation...
We also carry a wide selection of bare silicon wafers for your convenience.
Rogue Valley Microdevices offers the following Thermal processing:
- Wet Thermal Oxidation
- Dry Thermal Oxidation
- Dry Chlorinated Thermal Oxidation
- N2, N2/O2 Anneal
- Forming Gas Anneal
Quick Capability Links:
- Wet Thermal Oxidation
- Dry Thermal Oxidation
- Dry Chlorinated Thermal Oxidation
- Thermal Annealing
- Stoichiometric LPCVD Nitride
- Low Stress LPCVD Nitride
- Super Low Stress LPCVD Nitride
- Targeted Stress LPCVD Nitride
- PECVD Oxide/PECVD Carbon Doped Oxide
- PECVD OxyNitride
- PECVD Nitride/PECVD Low Stress Nitride
- PECVD Silicon Carbide
- Metal/PVD Dielectric Films
About Rogue Valley Microdevices, Inc.:
Founded in 2003, Rogue Valley Microdevices is the first company to establish a microelectronics manufacturing facility in beautiful Southern Oregon. Headquartered in Medford Oregon, we have quickly established ourselves as one of the premier Thin Films Foundries in the United States by providing our customers with great quality, customer service, and engineering support.
Our manufacturing facility contains processing equipment capable of volume manufacturing yet flexible enough to accommodate wafer sizes from 50mm to 200mm. We offer a variety of processes, including Low Stress LPCVD Nitride, PECVD Oxide, PECVD Nitride, PECVD Silicon Carbide, Thermal Oxidation, Chlorinated Oxidation, N2/H2 Annealing, and a variety of Metal films to satisfy our customers' needs.
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