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Rogue Valley Microdevices, Inc. - PECVD Oxide - 100A to 5 um Thick
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Rogue Valley Microdevices has PECVD Silicon Oxide available in our in-house facility in Medford, Oregon. Our PECVD Oxide is a single sided film that has been optimized for wafers requiring minimal thermal processing, and is often used during the semiconductor manufacturing process to form intra-metal dielectric stacks. PECVD Oxide is also used in MEMS and Surface micro-machining processes.
In addition to our standard PECVD Oxide we also offer carbon doped PECVD Oxide as a low-k dielectric. Our PECVD Oxide films offer you greater process flexibility and can be combined with many of our other films including PECVD Nitride, PECVD Amorphous Silicon, PECVD Silicon Carbide, LPCVD Nitride and PVD Metals.
Contact Us:
- Email us for specific application and capability questions - we are here to help!
- Request a Price Quotation...
We also carry a wide selection of bare silicon wafers for your convenience.
The following PECVD Films are available to provide you with more flexibility!
- Silicon Dioxide
- Amorphous Silicon
- Carbon doped Silicon Oxy-Nitride
- Silicon OxyNitride
- Silicon Nitride
- Silicon Oxy-Nitride
- Low Stress Silicon Silicon Nitride
- Silicon Carbide
Quick Capability Links:
- Wet Thermal Oxidation
- Dry Thermal Oxidation
- Dry Chlorinated Thermal Oxidation
- Thermal Annealing
- Stoichiometric LPCVD Nitride
- Low Stress LPCVD Nitride
- Super Low Stress LPCVD Nitride
- Targeted Stress LPCVD Nitride
- PECVD Oxide/PECVD Carbon Doped Oxide
- PECVD OxyNitride
- PECVD Nitride/PECVD Low Stress Nitride
- PECVD Silicon Carbide
About Rogue Valley Microdevices, Inc.:
Founded in 2003, Rogue Valley Microdevices is the first company to establish a microelectronics manufacturing facility in beautiful Southern Oregon. Headquartered in Medford Oregon, we have quickly established ourselves as one of the premier Thin Films Foundries in the United States by providing our customers with great quality, customer service, and engineering support.
Our manufacturing facility contains processing equipment capable of volume manufacturing yet flexible enough to accommodate wafer sizes from 50mm to 200mm. We offer a variety of processes, including Low Stress LPCVD Nitride, PECVD Oxide, PECVD Nitride, PECVD Silicon Carbide, Thermal Oxidation, Chlorinated Oxidation, N2/H2 Annealing, and a variety of Metal films to satisfy our customers' needs.
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