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Rogue Valley Microdevices foundry can provide Sputtered Metals and Sputtered Dielectrics. Our sputtering capabilities include PVD Metals, PVD Dielectrics, and Evaporated Metals including but not limited to Copper, Aluminum, Silicon, Silicon Nitride, and Evaporated precious metals on wafers sizes 50mm to 300mm in diameter.

We understand the importance of a clean process and all films are processed in a class 100 cleanroom. Our Sputter process has been designed to deposit ultra-clean, semiconductor grade metals and dielectric films. The process includes an in-situ RF etch (also known as sputter etch) which ensures good film adhesion and Ohmic contact to underlying conductive layers. Rogue Valley Microdevices can also provide the conductive layers and metal adhesion and/or metal barrier layers. Here is a current list of Sputtered Films and Evaporated Films:

Here is a current list of Sputtered Films and Evaporated Films:

• PVD Metals: Tantalum (Ta), Titanium (Ti), Aluminum (Al), Aluminum/Copper0.5% (AlCu0.5%), Nickel (Ni), Tungsten (W), Chrome (Cr), Copper (Cu)
• PVD Dielectrics/Semiconductors: Silicon Nitride (SiN), Silicon (Si)
• Evaporated Metals: Gold (Au), Platinum (Pt), Chrome (Cr), Titanium (Ti), Nickel (Ni)

• Questions? Email us your specific application questions - we are here to help.
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If you do not see a film listed that you require please contact us. We are continually adding films to meet our customer's requirements. We have a highly experienced engineering, and technical sales team that are available to assist you.

Quick Capability Links:

• Wet Thermal Oxidation
• Dry Thermal Oxidation
• Dry Chlorinated Thermal Oxidation
• Thermal Annealing
• Stoichiometric LPCVD Nitride
• Low Stress LPCVD Nitride
• Super Low Stress LPCVD Nitride
• Targeted Stress LPCVD Nitride
• PECVD Oxide/PECVD Carbon Doped Oxide
• PECVD OxyNitride
• PECVD Nitride/PECVD Low Stress Nitride
• PECVD Silicon Carbide

About Rogue Valley Microdevices, Inc.:

Founded in 2003, Rogue Valley Microdevices is the first company to establish a microelectronics manufacturing facility in beautiful Southern Oregon. Headquartered in Medford Oregon, we have quickly established ourselves as one of the premier Thin Films Foundries in the United States by providing our customers with great quality, customer service, and engineering support.

Our manufacturing facility contains processing equipment capable of volume manufacturing yet flexible enough to accommodate wafer sizes from 50mm to 200mm. We offer a variety of processes, including Low Stress LPCVD Nitride, PECVD Oxide, PECVD Nitride, PECVD Silicon Carbide, Thermal Oxidation, Chlorinated Oxidation, N2/H2 Annealing, and a variety of PVD films to satisfy our customers' needs.

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