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Silicon Wafers - Because of our ability to process all wafers diameters (50mm-300mm) Rogue Valley Microdevices maintains a diverse inventory for customers whom require either bare silicon wafers or silicon wafers with Thin Films. Our ability to provide you with both thin films services and silicon wafers can help reduce cycle time as well as shipping cost.

Rogue Valley Microdevices can stock customer wafers so that customers can enjoy the quantity discount of ordering a higher number of silicon wafers but do not have to worry about having those wafers in inventory. We will keep the stock at our in-house processing facility in Medford, Oregon and when customers need the thin films deposited, they can just have the amount of silicon wafers they need at that time processed.

Click here to learn more about our Silicon Wafer Capabilities and Specifications....

Contact Us:

• Email us for specific application and capability questions - we are here to help!
• Request a Price Quotation...

Below is a list of thin films that we offer on silicon wafers. If you do not see a film listed that you require please contact us. We are continually adding films to meet our customer's requirements. We have a highly experienced engineering, and technical sales team that are available to assist you.

Quick Capability Links:

• Wet Thermal Oxidation
• Dry Thermal Oxidation
• Dry Chlorinated Thermal Oxidation
• Thermal Annealing
• Stoichiometric LPCVD Nitride
• Low Stress LPCVD Nitride
• Super Low Stress LPCVD Nitride
• Targeted Stress LPCVD Nitride
• PECVD Oxide/PECVD Carbon Doped Oxide
• PECVD OxyNitride
• PECVD Nitride/PECVD Low Stress Nitride
• PECVD Silicon Carbide
• PVD Metals
• PVD Dielectrics/Semiconductors
• Evaporated Metals

About Rogue Valley Microdevices, Inc.:

Founded in 2003, Rogue Valley Microdevices is the first company to establish a microelectronics manufacturing facility in beautiful Southern Oregon. Headquartered in Medford Oregon, we have quickly established ourselves as one of the premier Thin Films Foundries in the United States by providing our customers with great quality, customer service, and engineering support.

Our manufacturing facility contains processing equipment capable of volume manufacturing yet flexible enough to accommodate wafer sizes from 50mm to 300mm. We offer a variety of processes, including Low Stress LPCVD Nitride, PECVD Oxide, PECVD Nitride, PECVD Silicon Carbide, Thermal Oxidation, Chlorinated Oxidation, N2/H2 Annealing, and Sputtered Metals to satisfy our customers' needs.

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