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Rogue Valley Microdevices is proud to be your leading source of high quality LPCVD Silicon Nitride films. Our LPCVD Nitride Process uses very specific gas ratios to produce a stable LPCVD Silicon Nitride film that can target a customers film stress requirements. Our engineering team is able to offer our customers the opportunity to customize Film Stress to fit their exact application.

We have a highly experienced team of engineers and technical staff that can work with customers to define which film stress will yield the best results for their application. Once the targeted film stress meets the customers requirements, Rogue Valley Microdevices will develop a production capable process so that customers can place repeat orders and know that our detailed process records ensure they are receiving the exact Targeted Stress LPCVD Nitride recipe that was developed for them.

Contact Us:

• Email us for specific application and capability questions - we are here to help!
• Request a Price Quotation...

We also carry a wide selection of bare silicon wafers for your convenience.

Rogue Valley Microdevices offers the following LPCVD processes:

• Stoichiometric Nitride
• Low Stress Nitride (stress less than 250 MPa)
• Super Low Stress Nitride (stress less than 100 MPa)
• Targeted Stress Nitride (Film Stress Target +/- 50 MPa)

Quick Capability Links:

• Wet Thermal Oxidation
• Dry Thermal Oxidation
• Dry Chlorinated Thermal Oxidation
• Thermal Annealing
• Stoichiometric LPCVD Nitride
• Low Stress LPCVD Nitride
• Super Low Stress LPCVD Nitride
• Targeted Stress LPCVD Nitride
• PECVD Oxide/PECVD Carbon Doped Oxide
• PECVD OxyNitride
• PECVD Nitride/PECVD Low Stress Nitride
• PECVD Silicon Carbide
• PVD Metals
• PVD Dielectrics/Semiconductors
• Evaporated Metals

About Rogue Valley Microdevices, Inc.:

Founded in 2003, Rogue Valley Microdevices is the first company to establish a microelectronics manufacturing facility in beautiful Southern Oregon. Headquartered in Medford Oregon, we have quickly established ourselves as one of the premier Thin Films Foundries in the United States by providing our customers with great quality, customer service, and engineering support.

Our manufacturing facility contains processing equipment capable of volume manufacturing yet flexible enough to accommodate wafer sizes from 50mm to 200mm. We offer a variety of processes, including Low Stress LPCVD Nitride, PECVD Oxide, PECVD Nitride, PECVD Silicon Carbide, Thermal Oxidation, Chlorinated Oxidation, N2/H2 Annealing, and a variety of PVD films to satisfy our customers' needs.

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