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Rogue Valley Microdevices offers Wet Thermal Oxidation services up to 15µm. Our Wet Thermal Oxidation process is designed to provide the best quality film. We offer a film thickness range of 500 angstroms to 15 microns. Starting Silicon Wafers (50mm-200mm) can be provided or customers can send in their own wafers.

Our process capability allow up to provide thin film services on Silicon Wafers, SOI Wafers, EPI Wafers, and Solar Wafers. We can also provide these services on starting substrates that are extremely thin or thick. All of our thin films are processed in-house in a Class 100 Cleanroom in Medford, Oregon. Please contact us with your requirements!

Contact Us:

• Email us for specific application and capability questions - we are here to help!
• Request a Price Quotation...

Below is a list of thin films that Rogue Valley Microdevices offers. If you do not see a film listed that you require please contact us. We are continually adding films to meet our customer's requirements. We have a highly experienced engineering, and technical sales team that are available to assist you.

Quick Capability Links:

• Wet Thermal Oxidation
• Dry Thermal Oxidation
• Dry Chlorinated Thermal Oxidation
• Thermal Annealing
• Stoichiometric LPCVD Nitride
• Low Stress LPCVD Nitride
• Super Low Stress LPCVD Nitride
• Targeted Stress LPCVD Nitride
• PECVD Oxide/PECVD Carbon Doped Oxide
• PECVD OxyNitride
• PECVD Nitride/PECVD Low Stress Nitride
• PECVD Silicon Carbide
• PVD Metals
• PVD Dielectrics/Semiconductors
• Evaporated Metals

About Rogue Valley Microdevices, Inc.:

Founded in 2003, Rogue Valley Microdevices is the first company to establish a microelectronics manufacturing facility in beautiful Southern Oregon. Headquartered in Medford Oregon, we have quickly established ourselves as one of the premier Thin Films Foundries in the United States by providing our customers with great quality, customer service, and engineering support.

Our manufacturing facility contains processing equipment capable of volume manufacturing yet flexible enough to accommodate wafer sizes from 50mm to 300mm. We offer a variety of processes, including Low Stress LPCVD Nitride, PECVD Oxide, PECVD Nitride, PECVD Silicon Carbide, Thermal Oxidation, Chlorinated Oxidation, N2/H2 Annealing, and Sputtered Metals to satisfy our customers' needs.

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