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S-Bond Joining of Sputter Targets

S-Bond® active solders enable the joining of dissimilar metals and ceramics to each other and to other metals. S-Bond's patented alloys have active elements such as titanium and cerium added to Sn-Ag, Sn-In-Ag, and Sn-Bi alloys to create a solder that can be reacted directly with the metallic and/or ceramic surfaces prior to bonding. S-Bond filler metal alloy produce reliable joints with…copper, aluminum, steel, stainless steels, titanium, chromium, nickel alloys, refractory metal alloys and many ceramics including alumina, zirconia, AlN, SiC and joins to most semiconductors including Si, GaAs, CIGS, etc.

Sputter Target Image courtesy of Reactive Nanotechnologies, NanoBond® joining.

S-Bond can join…

- Directly without the use flux.
- Without pre-plating steps, eliminating multiple step coating processes.
- At temperatures below 300ºC
- and prevents distortion and softening of metals and prevents ceramic fracture.

The joints produced by S-Bond active solders are:

- Strong (> 5,000 psi shear)
- Ductile, based on Sn-Ag or Sn-In alloys
- Capable of service temperatures up to 190ºC.

S-Bond® active solder joining eliminates the need for flux and preplating while offering a capability to directly bond to ceramic and to semiconductor materials. S-Bond® simplifies the joining of many of the typical sputter target geometries, the joining materials are Pb-free and their temperature capabilities exceed that of Indium. For example, S-Bond 220 and 220M joined sputter targets interfaces have shear strengths of 3 – 5,000 psi (20-32 MPa) and an be taken to 195ºC without significant lowering of the room temperature values.

Sputter target materials that can be joined with S-Bond® filler metals to copper and other backing metals include…

Metals

Gold
Silver
Nickel
Vanadium
Antimony
Tellurium
Germanium
Aluminum
Titanium
Copper
Tantalum
Cobalt
Iron
Chromium
Manganese
Stainless steel
Molybdenum
Tungsten

Semiconductors / Compounds / Ceramics

Silicon
Gallium Arsenide
Zinc Sulfide
Silicon Dioxide
Indium Tin Oxide (ITO)
Al – Zinc Oxide (AZO)
Indium Zinc Gallium Oxide
Aluminum Oxide & Zirconium oxides
Most other Metal Oxides
Titanium carbide & Silicon carbide
Copper indium gallium (di)selenide (CIGS)
Cadmium telluride

Contact us for a demonstration of S-Bond's unique and capability to meet many of your sputter target joining requirements.