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S-Bond active solders can join aluminum without the use of flux. The active elements in S-Bond alloys 220 and 220-50 interact with the natural protective oxide that forms on aluminum alloys. Soldering to aluminum normally requires special fluxes or techniques to break through the natural surface oxide film and allow the flux to bond. S-Bond solders' active elements easily react through the oxide layer to react quickly with the aluminum metal without the use of additional chemicals. In many cases of conventional solder joining, nickel plating is used in combination with flux. S-Bond joining eliminates the need for both.

S-Bond easily and reliably joins aluminum at much lower temperatures but does require special processing techniques which disrupt the S-Bond alloys' naturally formed oxides which we term "mechanical activation". Lower temperature solder joining prevents the softening of aluminum alloys that normally occurs in dip or controlled atmosphere joining.

S-Bond offers a range of active solders available with different service temperatures from 100°C to 390°C, as well as a broad range of bond strengths. These same products also join aluminum to copper, other metals and ceramics, and other thermal management materials and allow fluxless assembly of complete thermal management components.

For applications that have service temperatures below 195ºC (375ºF), S-Bond joining can be used to replace many aluminum brazing processes. S-Bond joining can produce hermetic seals on a variety of joint types, from tubes to overlaps. Unlike aluminum brazed joints, the S-Bond joint can be taken apart and re-joined as needed.

S-Bond can join all aluminum alloys, including aluminum matrix composites.

Applications include:

- Cold Plates - Cooling Tubes - Heat Sinks & Spreaders

- Hermetically sealed phase change cooling chambers

- Fin Structures - Feedthru's( mechanical & electrical) - Housings

- Foams - Battery terminals - Structures / Enclosures

- Solar panels - Electronic Packages