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S-Bond Technologies offers joining services for components that require graphite, graphite foams, pyrolytic carbon, carbon foams, carbides and diamond. The active elements in S-Bond alloys and our proprietary joining processes enable the joining of any metal to most carbon based materials in a wide range of applications

Our joining methods have the following characteristics:

• No flux , no filling of pores when joining foams.

• No plating required.

• Joins carbon based materials to most metals, ceramics and composites.

• Joints are made at lower soldering temperatures and can be reworked.

• S-Bond joining mitigates thermal expansion mismatch issues experienced in brazing.

S-Bond characteristics include:

• Alloy 220 joins from 250-270°C.

• Alloy 400 joins from 410-420°C.

• Thermally conductive, over 10 x that of filled epoxies

S-Bond Alloy 220 can wet (liquid spreading without balling up) and adhere to the surface of the graphite and graphite foams, carbides, carbon and diamond. After pre-treatment with S-Bond layers, the graphite / carbon / carbide based materials can be joined to electrical leads, metal face sheets or other types of metals and composite structures. When joining graphite foams, S-Bond alloys wet and encapsulate the Gr-foam webs, leading to adherence and gripping around the Gr-foam webs, thus creating strong and thermally conductive joints. S-Bond joining is an effective method for joining highly conductive graphite foams to metallic and composite face sheets.

S-Bond Technologies provides a range of versatile fabrication services to joining components such as:

- graphite foam core cold plates - graphite foam heat storage units

- thermal management devices - diamond or diamond composite heat sinks

- SiC armor plates - SiC based power electronic assemblies

- wear plates and surfaces - graphite conductors and feedthru's