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S-Bond Technologies offers joining services for assembling cold plates, cold pipes, heat sinks, heat spreaders and many other style thermal management components. Our capabilities extend from production of small to large units and our manufacturing operations can support small to larger lot production quantities.

Demonstrated expertise in joining a wide range of materials and in many dissimilar material combinations. S-Bond joining permits the joining of aluminum, copper, and many other metals. S-Bond joins high performance thermal management materials such graphite foams (e.g. PocoFoam®, Koppers, etc.), pyrolytic graphite, and K1100 graphite fibers. Aluminum nitride and even beryllium oxides, used as thermally conductive oxides can also be joined using S-Bond active solders. Electronic packages many times incorporate combinations of materials while still requiring relatively high thermal conductivity. To manage thermal expansion mismatch stresses, some high performance packages utilize composites such as copper-tungsten, copper-graphite fiber, and aluminum-silicon carbide, or diamond composites, all which can be joined with S-Bond materials and techniques.

Prototype and Manufacturing Services

Our services extend from assembly-only to make complete… we fabricate Al-Al tube Al – copper tube, Al-Copper-Stainless steel fitting cold plates of all sizes and have produced special thermal storage devices for military and commercial components used on high power electronic devices for cooling transients with phase change materials held in the pores of graphite foams. S-Bond is used to bond the graphite foams to aluminum and then joining the aluminum enclosures to copper heat sinks or aluminum fins. S-Bond active solders do not use flux for joining, nor do they require plating of the component base metals.. These characteristics make S-Bond very suitable for joining graphite and metallic foams.

SBT has also developed low temperature active solders to successfully join water - wick heat pipes to aluminum and copper bases. Pyrolytic graphite and conductive thermally conducting ceramics (AlN and BeO) have all been able to be joined to aluminum, kovar, Al-SiC and stainless steel. S-Bond joining is an extremely flexible joining process and alloys are available from 115ºC up to 420ºC… providing for a range of operating temperatures and a wide range of materials and application…

S-Bond alloys have thermal conductivities from 50 – 90 W/m-K, from 10 – 20 times the thermal conductivity of many thermal interface materials (TIM) and thermally conductive epoxies. S-Bond alloy are less expensive than many of the other commercially available TIM and thermally conductive epoxies and provide stable metallic joints that can be hermetic and not susceptible to degradation from moisture or UV exposure. These attributes make S-Bond joining, in many cases, superior to conventionally TIM materials and to epoxy based thermal joining solutions.

S-Bond joining is proven solution in many thermal management component assemblies, so contact us for evaluating S-Bond and for production of your thermal management components.

Examples of S-Bond Joined Thermal Components

- Al-Al Cold plates - Al-Cu Cold plates - Heat Sinks (Cu, Al, AlN, Cu-W )

- Al or Cu Finned structures - Heat pipes - Gr-Foam Core Heat Exchangers

- Heat Spreaders (Al-Cu-Gr) - Phase Change Cooler - Vapor chamber coolers