Hermetic Non-magnetic Micro-D
Product Announcement from Hermetic Solutions Group
Designed to be laser welded into Hermetic Solutions Group's titanium or titanium composite electronic packages, these Micro-D connectors can be manufactured in 9, 15, 21, 25, 31, 37, 51 and 100 pin configurations. These connectors use PA&E's unique polycrystalline ceramic sealing technology to deliver a leak rate of less than 1X10-9cc/sec Helium at 1 atmospheric differential pressure. The non-magnetic Micro-D line provides insulation resistance of more than 5,000 Megohms at 500 VDC and exhibit no evidence of breakdown or flashover when tested in IAW MIL-STD-1344, Method 3003. They will perform reliably in temperatures ranging from -65ºC to 260ºC.