Product Announcement from SUSS MicroTec
Designed for advanced MEMS manufacturing and 3D wafer bonding, the CBC200 is a fully automated, best in class, wafer bond cluster with up to 90 kN bond force and 500°C thermal capacity. All standard MEMS fabrication processes as well as emerging eutectic, fusion, and metal diffusion bond technologies for integrated devices can be performed with low cost of ownership.
The CBC200 offers uninterrupted operation while running multiple recipes and multiple process flows. All cluster systems can quickly be reconfigured in the field by adding or replacing modules to keep pace with growing production needs or changes in technology requirements.
- Bond force to 90kN and temperatures to 500°C with precision control and uniformity
- Alignment accuracy for metallic bonds to ±1.5µm
- Proven, award winning cluster design concept and software for reliable 24/7 production
- 3D Integration Stacking Technologies
- Polymer Adhesive Bonding
- Metal Eutectic Bonding
- Anodic Bonding
- Metal Diffusion Bonding