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Q2™ Rugged/High Speed Interconnects

Product Announcement from Samtec Inc.

Q2™ Rugged/High Speed Interconnects-Image


  • Pitch: .635mm (.025")
  • Stack Height: 10-16mm
  • Contacts: Up to 208 I/Os
  • Performance: Up to 8.0 GHz / 16 Gbps


  • QFS –.635mm Socket
  • QMS - .635mm Terminal
  • QFS-DP – .635mm Differential Pair Socket
  • QMS-DP – .635mm Differential Pair Terminal
  • QFSS – .635mm Shielded Socket
  • QMSS – .635mm Shielded Terminal


  • Optional EMI shielding
  • Increased insertion depth
  • Dual stage hot pluggable
  • Integral ground/power plane
  • Retention pins available
  • Power and RF end options
  • 15,24mm stacking version meets PCIE specifications
  • Vertical, perpendicular, and horizontal applications
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