CALMARK™ Conduction Cooled Assemblies & Clamshells
Product Announcement from Schroff
Schroff® CALMARK™ Conduction Cooled Assemblies and Clamshells provide an efficient thermal path for the heat generated from the processor to the cold wall.
- Prevent premature wear and failure by transferring heat away from critical electronics
- Rugged cooling solution for demanding applications
- Customized frames and clamshells to match PCboard component layout
- Assemblies consist of a cooled frame and backing plate
- Clamshells consist of a two-part covering for either 3U or 6U PCBs, ccPMC or XMC mezzanine cards
- Available in a number of specifications and variants
- Critical Electronics
You have successfully added from to your part list.