Product Announcement from Schroff


Modular Conduction-Cooled Assembly-Image

Overview

Schroff® CALMARK™ Modular Conduction-Cooled Assemblies provide high thermal conductivity.

Features

  • Easily adapts to electronics cooling requirements
  • Used when passive free air convection or active forced air cooling is not possible
  • Improves the structural rigidity of the standard commercial board, minimizing flexing of the board and meeting shock and vibration requirements for rugged applications
  • Stiffening ribs help to reduce the board from flexing during mechanical shock and vibration
  • A vacuum plate can be added which acts as a heat spreader for board components
  • If a vacuum plate is not used, vacuum thermal strips can be used to provide the appropriate spacing to go into the chassis cold wall channel
  • Machined aluminum cooling frame
  • Built to order

Applications

  • Cooling critical electronics
  • Defense
  • Military
  • Security
 
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