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SenDEC offers a wide range of services for PCB manufacturing, subassembly, electromechanical assembly, final product assembly (box build) and full turnkey production. Whether your board is simple or complex, and no matter what quantity you need, you get the same high quality, quick time-to-market service that has made SenDEC one of the fastest growing companies in the nation.

PCB Manufacturing Services at a Glance:

SenDEC provides personalized service, quality processes, and comprehensive manufacturing capabilities, including:

• High Speed SMT Board Assembly, Single and Double Sided
• Fine Pitch 0201 Component Placement
• BGA & Micro BGA (Ball Grid Array)
• RoHS Compliant Assembly
• Mixed Technologies (Through-Hole and SMT)
• PCB Subassembly
• Electromechanical Assembly
• Final Product Assembly (Box Build)
• 100% Material Procurement, 100% Consigned Material Management, or a Mix of Both
• Project Management
• Value Added Services

Their manufacturing process includes initial design and in-process quality inspections throughout. Your product is produced at the lowest possible cost without compromising on quality.

The Benefits To You

• SenDEC has over 30 years of electronics manufacturing expertise that will be applied to your project as their customer including:
• SenDEC Customer Service
• SenDEC Quality Processes
• Precision Placement
• Faster Throughput
• Lower Costs Through Automation
• SenDEC Component Expertise and Procurement Leverage
• Feedback On Cost Reduction Opportunities

Value Added Services

• In addition to their core advantages, SenDEC offers a variety of value-added services to meet your special requirements or product applications.

Automatic Optical Inspection (AOI)

• SenDEC's AOI stations offer superior fault coverage and are able to inspect all components optically for placement (absence and presence), value, orientation, type, color differences, soldering, short circuits, and dry joints. This is the most cost effective way for SenDEC to inspect all populated printed circuit boards.

X-Ray Inspection

• SenDEC uses a state-of-the-art x-ray system to provide the highest level of quality inspection for process and board analysis. While X-ray inspection is essential for verifying the quality of BGA (Ball Grid Array) components, it is also useful for analysis of standard IC packages and connectors.
• With x-ray inspection, SenDEC's engineers can look through the board and components associated with hidden failures to identify and solve problems that would be impossible to find through visual inspection alone.
• In many cases they're able to remove defects during the manufacturing process and avoid the expensive performance problems that they might cause. SenDEC saves all our x-ray inspection images in digital form for future references and to verify manufacturability.

Testing

• SenDEC's offers in-circuit and functional testing of electronic assemblies. SenDEC's Test Engineering Department is staffed by electrical engineers and technicians with years of experience building test equipment and developing effective test methodologies. They can utilize your existing test fixtures or design them themselves. Either way, they will make sure that your finished product will meet or exceed your quality and performance requirements.

Programming of Components

• SenDEC's Engineering Department is capable of programming a wide variety of devices.