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SenDEC has over 20 years of SMT (surface mount technology) expertise for you to leverage. Although the equipment and processes have changed over these years, one thing has not - their commitment to your project.

Today, they utilize state-of-the-art, fully automated placement equipment to quickly and accurately assemble SMT PCB (printed circuit board) assemblies. Their three fully automated SMT lines are rated at over 180,000 parts per hour, and up to 2,500 components per PCB. Their dedicated RoHS line includes the latest Vitronics reflow oven with lead-free capability.

Their automated SMT lines are capable of placing fine pitch package sizes such as 0201 components and micro-BGAs to .010" (.25mm) diameter and .021" (.53mm) minimum pin pitch. One of SenDEC's core values is Commitment To Excellence and we live this value through continuous investment in modern processes, tools, and training of our employee family - the benefits of which you receive as our customer.

SMT Assembly Capabilities at a Glance:

High Speed Automation

• AccuFlex Screen Printers
• Panasonic CM402A High Speed Machines
• Panasonic CM402C High Speed and Flexible Placement System
• Universal Instrument GSM and Flexible Placement Systems
• Vitronics Reflow Ovens
• Electrovert Wave Solder Systems
• In-line Aqueous Cleaners

Component Packages Including

• BGA (ceramic, metal plastic)
• Micro-BGA
• 0201 and larger chip-type components
• SOIC
• PLCC
• QFP
• CSP

Fine Pitch Placement

• Leaded Minimums:
• .0065" (.16mm) width
• .010" (.25mm) pitch
• BGA/CSP Minimums:
• .010" (.25mm) diameter
• .021" (.53mm) pitch

Board Sizes

• Single and Double Sided
• 2"x2" (50.8mm x 50.8mm) min to 20"x18" (508mm x 457.2mm) max