ENVIRONMENTAL CHARACTERISTICS
5-1 High temperature exposure
Subject the device to +85℃ for 16 hours. Then release the filter into the room conditions for 24 hours prior to the measurement. It shall fulfill the specifications in table 1.
5-2 Low temperature exposure
Subject the device to -20℃ for 16 hours. Then release the device into the room conditions for 24 hours prior to the measurement. It shall fulfill the specifications in table 1.
5-3 Temperature cycling
Subject the device to a low temperature of -40℃for 30 minutes. Following by a high temperature of +80℃ for 30 Minutes. Then release the device into the room conditions for 24 hours prior to the measurement. It shall meet the specifications in table 1.
5-4 Resistance to solder heat
Dip the device terminals no closer than 1.5mm into the solder bath at 260℃ ±10℃ for 10±1 sec. Then release the device into the room conditions for 4 hours. The device shall meet the specifications in table 1.
5-5 Solderability
Subject the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than 95% area of the terminals must be covered with new solder. It shall meet the specifications in table 1.
5-6 Mechanical shock
Drop the device randomly onto the concrete floor from the height of 1m 3 times. the device shall fulfill the specifications in table 1.
5-7 Vibration
Subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude of 1.5 mm at 10 to 55 Hz. The device shall fulfill the specifications in table 1.
5-8 Lead fatigue
5-8-1 Pulling test
Weight along with the direction of lead without an shock 1kg. The device shall satisfy all the initial Characteristics.
5-8-2 Bending test
Lead shall be subject to withstand against 90℃ bending with 450g weight in the direction of thickness. This operation shall be done toward both direction. The device shall show no evidence of damage and shall satisfy all the initial electrical characteristics.
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