Stockwell carries a variety of thermal management products, the most popular being Gap Fillers or Gap Pads. These materials are thermally conductive that have a "dough" like consistency. These very soft gap fillers are designed to conform to and fill in between inconsistent surfaces as well as fill microscopic voids on contact surfaces. As an example, the surface of a heat generating microprocessor and a heat sink will never mate perfectly. The air gaps between the surfaces will prohibit good heat transfer. By filling these gaps with thermally conductive materials, the heat generated by the microprocessor can be properly managed, which in turn will aid in performance and reliability. Due to the cost of gap fillers and gap pads, Stockwell takes extra effort to optimize the yield and minimizing waste.
Print
