A breakthrough in low fire ceramic chip manufacture has enabled Syfer to launch its highest capacitance devices ever. Increased capacitance values are available in the 16V, 25V and 50/63V series of multilayer chip capacitors. A brand new 10V range has also been launched, based on X5R dielectric.
Capacitance has more than doubled in most devices in these ranges for the C0G/NP0 dielectric. For the new 10V range, parts in the C0G dielectric range from a 0603 device with 392nF capacitance to a 564nF part in a 2225 footprint.
Similarly dramatic improvements in capacitance have been achieved with the X7R dielectric. A typical device, such as the 0805 footprint 16V part, now features an impressive 680nF capacitance, more than double the 330nF available previously.
In addition, Syfer has introduced an X5R dielectric, in voltages from 10V to 53/65V and packages from 0603 to 2225, typically providing increased capacitance over their X7R counterparts. However, it should be noted that these parts are only specified to 85oC, while the X7R range is qualified up to 125oC.
The key advantage of low fire capacitors over those produced using a high fire process, is reliability. For industry sectors such as medical, automotive, military & aerospace and industrial control, ruggedness and reliability are critical. Typically the low fire process produces a more structurally stable component body, with a higher dielectric constant, a lower volt per micron rating, and reduced capacitance loss.
For added reliability, Syfer offers its FlexiCap TM polymer termination option, as an alternative to a standard plated termination. Flexicap accommodates a greater degree of board flex than a conventional termination. To meet the most stringent quality standards, Syfer can also offer additional testing services. For further information on additional testing please see our Product Test and Reliability Guide.
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