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CMP Wafer Polishing Pressure Distribution

Product Announcement from Tekscan, Inc.

CMP Wafer Polishing Pressure Distribution-Image

The I-Scan® system provides the diagnostic tools necessary to evaluate, view, and balance the forces acting on a silicon wafer during the polishing process.

A study was conducted to collect and analyze the pressure distribution under a polishing head. Using a unique I-Scan pressure sensor with a sensing area of 9 1/2" X 9 3/4", measurements were taken to determine the pressure distribution of the polishing head and the wafer interface. Balancing these pressures during machine set-up can assist in improving yields and machine utilization.

The sensor was used to collect both static and dynamic pressure changes. The results of the study could be seen in 2-dimensional and 3-dimensional displays. A graph can be created to show a cross sectional representation of the pressure distribution of the polishing head and wafer interface.

The system can be used in conjunction with single-spindle or multi-spindle heads. Custom sensor designs are available, and can be designed to allow measurement of the entire area under a multi-spindle head.

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