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Testbourne Ltd. - SBT Sample Preparation Equipment Electron Micro
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Electron Microscopy
South Bay Technology offers a complete solution for TEM specimen preparation. SBT offers systems for each stage of the preparation process from bulk material processing to low energy ion milling and plasma cleaning. SBT also offers the most advanced systems for ion beam sputter deposition and etching which produces ultra-thin, uniform and fine grain metal and carbon films on specimens for FESEM and TEM applications.
Model 310
For punching out 3mm discs from thin metal sheets for TEM without mechanical distortion.
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Model 360
For cutting 3mm discs for TEM and larger discs up to 50mm in diameter using a gentle rotary action with an abrasive slurry or diamond-tipped tool.
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Model 380
Utilizes abrasive powders and high speed, vibratory motion to cut discs, holes, cylinders, squares and other shapes from hard, brittle materials.
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Model 595
A compact specimen preparation tool for mechanical polishing of SEM and TEM cross sections.
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Model 590
For preparing samples for both SEM and TEM analysis, in both plan-view and cross section view utilizing mechanical polishing techniques.
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Model 515
For pre-thinning TEM specimens either prior to ion milling or prior to a quick etch on the Model 550D Single Vertical-Jet ElectroPolisher.
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Model D500I
Utilizes a breakthrough in electronic and mechanical integration which continuously monitors and controls dimpling parameters and accurately terminates at a preset specimen thickness.
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Model PC2000
For simultaneous cleaning of a specimen and a specimen stage which minimizes hydrocarbon contamination of specimens analyzed via SEM, TEM, STEM and/or AEM.
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Model IBS/e
Ion Beam Sputter Deposition and Etching System
Improves high resolution electron microscopy imaging by depositing ultra-thin, fine grain metal and carbon films on specimens.
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Model 550D
Single Vertical Jet Electropolisher
For dislocation free thinning of metals, semiconductors, superconductors, glass and ceramics for TEM analysis using either electrolytic or chemical action.
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Model 520
A simple and inexpensive method of producing superior cross sectional TEM specimens from Si, Ge, lll-V, ll-VI semiconductors, glass, sapphire, MgO, and other brittle materials.
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Lapping & Polishing
South Bay Technology has developed fully integrated lapping and polishing systems for the processing of Si, LiNbO3, SrTiO3, TiO2, InP, GaAs, SiC, Sapphire and similar materials. Systems are suitable for flat and parallel lapping of wafers, edge polishing of wave guides and angle polishing of crystals to precise tolerances with a scratch free surface finish.
Model 451
For damage free machining of materials by electrolytic or chemical action to produce flat, polished and precisely oriented surfaces.
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Model 460
Automatic Electrolytic Crystal Polisher
Similar to the Model 451, but with an automatic feed feature.
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Model 900CE
An 8" (200mm)wheel for low volume metallographic polishing.
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Model 910
Lapping and Polishing MaChine 910
A multi-purpose 8" (200mm) instrument designed for precision lapping and polishing as well as standard metallurgical grinding.
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Model 920
Lapping and Polishing Machine 920
A multi-purpose 8" (200mm) instrument used for accurately lapping and polishing materials utilizing integrated workstations and precision lapping and polishing fixtures.
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Cutting & Sectioning
South Bay Technology has developed a series of precision saws to meet the extremely diverse requirements in a wide range of materials processing applications. System capabilities range from high precision slicing of extremely brittle materials to the less stringent application of metallographic sectioning. Systems also offer the ability to precisely cut oriented single crystals using wire blades, diamond wheels or acid etching.
Model 650
Low Speed Diamond Wheel Saw 650
A compact, multipurpose, precision saw designed to cut a wide variety of materials up to 1.3" (33mm) in diameter with minimal subsurface damage.
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Model 660
Low Speed Diamond Wheel Saw 660
A multipurpose precision saw using diamond wheels up to 7" (178mm) in diameter for cutting a wide variety of materials up to 2.8" (71mm) in diameter with minimal subsurface damage
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Model 750
For damage free cutting of materials using acid or solvent which is compatible with its PVC and stainless steel construction.
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Model 810
The most gentle mechanical method for cutting virtually any material using either a diamond impregnated wire blade or a plain wire blade with an abrasive slurry. The Model 810 incorporates a simple, low volume abrasive recirculating system and can be used to accurately cut oriented crystals.
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Model 850
The most gentle mechanical method for cutting virtually any material using either a diamond impregnated wire blade or a plain wire blade with an abrasive slurry. The Model 850 can be used to cut oriented crystals and is also capable of precision alignment with the optional alignment microscope.
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Model 865
For medium precision, efficient cutting of virtually any material, including hard steels, soft polymers, and brittle materials.
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Microelectronic Processing
Model 575
Backside Emission Analysis Preparation System (BEAPS)
For backside thinning packaged die to less than 50 microns while maintaining package integrity.
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Model PE2000
For isotropic reactive gas plasma etching, cleaning and surface treatment.
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Model RIE2000
For anisotropic reactive gas etching of microelectronic devices, deprocessing and failure analysis applications.
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Crystal Orientation
South Bay Technology Crystal Orientation tools are unique in their ability to interface with SBT cutting and polishing systems. A crystal can be oriented on an x-ray track, transferred to a cutting instrument and subsequently transferred to a lapping and polishing system all while maintaining crystal orientation.
Model 170
Integrated orientation, lapping and polishing within 0.1°.
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Model 210
Optical Orientation Instrument
Reflected laser beam orientation from cleaved or preferentially etched crystal surfaces.
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Model 250
For use with orientation, cutting and polishing systems.
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Model 25010
Oriented Crystal Lapping Fixture
For integrated orientation, cutting and polishing using the Model 250 Goniometer.
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Model 260
For orientation prior to cutting on the Model 850 Wire Saw or Model 660 Diamond Wheel Saw.
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Model 265
The Model 265 is a larger version of the Model 260 and is mounted on a 7" square flat base which can be adapted for a wide range of applications.
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Accessories
South Bay Technology has carefully selected and qualified products that meet the stringent needs of materials analysts. This comprehensive, unique and competitively priced range of consumables for electron microscopy and metallography provides the assurance that the customer is receiving only the highest quality products.
Model 930
Used in conjunction with acrylic and epoxy cold mounting materials to produce clearer, denser, and less porous mounts.
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Model FIB
Fortress™ FIB Holders are reusable holders that secure FIB samples that are held in a specific orientation without the use of adhesives, adhesive pads, or conductive paint.
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Model SS100
Sample Saver™ Storage Container SS100
The SampleSaver™ Portable Storage Container system is a specialized container that enables a user to replace the reactive atmospheric air typically present in the container with an inert gas species.
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Model SS200
Sample Saver™ Storage Container
The SampleSaver™ Portable Storage Container system is a specialized container that enables a user to replace the reactive atmospheric air typically present in the container with an inert gas species.
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Lapping Fixtures
Model SLP1
Shim Controlled Lapping Fixtures
The shim controlled lapping and polishing fixtures are designed to lap or polish samples to the same thickness over and over again using shims to control the final thickness.
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Model MLP1
South Bay Technology has developed a large number of lapping and polishing fixtures that hold samples from less than 1/8" to over 8" in diameter.
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Model MLP2
The South Bay Technology Precision Lapping and Polishing Fixtures are designed to accurately produce polished parallel, tapered or critically oriented samples with minimal sub-surface damage. A series of specialized fixtures has been developed for lapping
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Model VLP1
In most materials preparation laboratories, lapping and polishing of materials is necessary for both process control and specimen analysis.
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