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Sputtering is a proven technology capable of depositing thin films from a wide variety of materials on to diverse substrate shapes and sizes. The process is repeatable and can be scaled up from small research and development projects, to production batches involving medium to large substrate areas. The sputtering gas is often an inert gas such as argon. For efficient momentum transfer projectile mass must match target mass, so for sputtering light elements neon is also used and for heavy elements krypton or xenon. Reactive gases are used to sputter compounds. The chemical reaction can occur on the target surface, in-flight or on the substrate depending on the process parameters. The many parameters make sputter deposition a complex process but allow experts a large degree of control over the growth and microstructure of the film.

To achieve the desired characteristics in a sputter deposited thin film, the manufacturing process used to fabricate the sputtering target can be critical. Whether the target material comprises only an element, mixture of elements, alloys, or perhaps a compound; the process to produce that defined material in a form suitable for sputtering thin films of consistent quality is as essential as the deposition run parameters perfected by the thin film process engineers and scientists.

SuperVac® Sputtering Targets:

Most sputtering target materials can be fabricated into a wide range of shapes and sizes. There are some technical limitations to the maximum size for a given single piece construction. In such cases, a multi-segmented target can be produced with the individual segments joined together by butt or beveled joints. Commonly used targets are circular or rectangular, although other shapes including square and triangular designs can also be produced.

Pure Metal Targets

An extensive range of metal targets in sizes ranging from 1 inch in diameter to several meters long rectangular plates. Sputter target materials can be generally supplied within the purity range of 99% to 99.9999% but the higher purities are more material dependent. more»

Alloy Targets

Advancement in alloying techniques has enabled Testbourne to offer a wide range of targets with particular emphasis on specialty custom fabricated alloys. more»

Compound Targets

A wide selection of compound based sputtering targets: oxides, nitrides, borides, sulfides, selenides, tellurides, carbides, crystalline and composite mixtures. more»

Small Bench Top Coater Targets

These 0.1-0.5mm thick targets are mostly made of Titanium Ti, Chromium Cr, Tantalum Ta, Gold Au, Silver Ag, Platinum Pt, Palladium Pd and their alloys.

The targets are designed for laboratory bench coaters and are predominantly 57mm diameter Targets for Agar, Cressington 108/208, Emitech K575/675, ISI 5400, JEOL JFC 1200/1300, PELCO Model 3, SC4/SC5/SC6/SC7, Polaron 5000/5400/SC7610/SC7620, Quorum E5000 / E5400 / E5200 / SC7610 / SC502 / SC7620 and SPI Module/Super sputter coaters.

54mm diameter Targets for Bal-Tec SCD005/050 and MED10/20 Sputter Coaters.

And smaller diameter targets 19mm, 25.4mm and other standard diameters. more»