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Using a Feinfocus Cougar-VXP Series Real-Time X-Ray System, Trace can look inside any device while it is in operation to observe possible defects in materials, or any motion-related operational problems. Conventional X-Ray systems cannot furnish the same level of detail or observe the interior of moving systems in real time–as is possible with this sophisticated Real-Time X-Ray System. Trace is one of a very few independent test labs to offer this service as part of their Root Cause Failure Analysis program.

Applications for this advanced X-Ray technology are virtually unlimited. Parts ranging from low-density plastics to high-density steel can be observed with a high degree of detail due to the variable-power capability of the X-Ray tube. In addition, since the device under test can be rotated while running, its operation can be observed from virtually any angle. The real-time video resulting from this 3D observation can be burned onto a DVD for future review by Trace or Trace clients.

Trace specializes in the measurement and test of electronic components and assemblies, and they expect to use the Cougar-VXP for the evaluation of circuit boards, semiconductor packages, electronics assemblies, electronic components, and more. Typical anomalies detected would include voids, cracks, missing or defective wire bonds, and mechanically-induced harmonic vibrations. Test items can be as large as 17" x 21" (440mm x 550mm), and examination can take place down to 0.3µm and with magnifications up to 9,000x.

While the Cougar-VXP is a new acquisition for Trace, their engineers already have considerable experience using this powerful tool. It further expands Trace's full suite of testing services.

X-Ray Fluorescence

X-Ray Fluorescence (XRF) is an application that is used to easily and effectively measure coating/plating thicknesses that other techniques cannot. An XRF spectrometer is a bench top unit that can obtain thickness measurements on a variety of single and multiple "layered" substrates in a non-destructive and contact-free manner.

For the electronics/printed circuit board industry specifically; platings such as silver, copper, gold, nickel, tin, and even tin-lead can be analyzed on top of many different substrates such has copper, steel, brass, etc.

For measuring, the test specimen is positioned on the measurement stage and then brought into focus on the camera screen. With the software, specific locations or areas of interest in the x-y plane can then be selected and programmed for plating measurement. Once programmed, the instrumentation is then activated causing a beam of primary X-Rays to strike the surface at the location of interest.

This bombardment of photons causes the elements present in the coating/plating to emit characteristic fluorescent X-Ray lines that can be collimated, selectively separated, and then analyzed using a proportional counter. This data is then correlated to a plating thickness measurement using standard thickness foils.

Printed circuit board samples upwards of two (2) foot square can be analyzed easily with collimated spot sizes down to 4 mils.

View our complete list of X-RAY SERVICES services and capabilities.