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Foundry Services and design services from Universal Semiconductor, Inc. are Ideal for Prototyping, Product Development, Initial Product Runs, Market and concept testing services.

Please use the links to the right for additional information, ask a questions or to request a quotation.

Some of USI's Capabilities and Expertise

Diffusion: Twenty four furnaces for thin film, CMOS and Bipolar and other processes. These include:

• Very clean oxidation furnaces with Trans LC
• Nitride and Poly Deposition.
• PSG, BPSG., Vapox.
• Boron doping with BBR3.
• LPCVD nitride deposition
• PECVD nitride deposition
• LTO doped and undoped
• Long high temperature drives up to 1200o C
• Ultra pure gate oxide

Deposition

Etching

Photo Lithography

Metal deposition

Doping

MEMS

USI offers Design Engineering, Manufacturing and Testing capability for wide ranging MEMs products and devices and for various applications such as:

We also do complete processing. To name a few: Bipolar; CMOS; BiCMOS; Hi Voltage; MEMS; Solar Cells and for Opto-electronics. In case you have any requirement, even if it differs from the above, please feel free to get in touch with us, and we will do our utmost to meet your needs. Let us have the details and we shall respond to your requirements immediately.

Universal Semiconductor Inc is one of the early pioneering semiconductor companies in the world that extended and developed innovative technologies for diverse applications. Its major technological achievement is its unique High Voltage Technologies and Mixed Signal capabilities.

USI list of processes and products include Analog and Mixed Signal ASICs, Mask Programmable Arrays, Schottky Diode Networks, ESD protection ICs, MOSFETs, N-Channel enhancement mode lateral DMOSFETs, IEEE1284 Terminator Networks, EMI Protection ICs, High Voltage ICs, DI Process, 750V ICs, MEMs foundry, CMOS Foundry, MUXes, high performance Op Amps and Comparators, High Voltage Op Amps and Analog switches to name a few.