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Universal Semiconductor (USI) expands its Turn Key wafer fab capabilities to include 6" wafer now offering 2', 3", 4", 5" and 6" wafer foundry services.

USI's expanded lithography equipment includes new submicron ASML PAS 2500/40 Stepper Aligner, Spinners, Lam and Tegal Dry Plasma Etchers for up to 6" wfrs.

USI's expanded Metal Deposition and Diffusion processes provide a diverse range of standard processes or custom <1 micron to 5micron feature size or larger.

USI's Patent Semiconductor technologies and processes include CMOS, DMOS, Bipolar devices, Double Diffusion Photodiodes/Detectors and Solar Cells. Universal Semiconductor's facility is headquartered in San Jose, CA is responsible for the Marketing, Sales, Support, Development, and Manufacturing for its branded, custom and Foundry services.

USI now offers a Turnkey Foundry resource for its customers that is extremely capable and competitive priced said Vic Hejmadi, CEO and President of USI.

USI's new 6" fab services will commence in April 2006 in addition to our on-going 2"- 5". We also offer selected processes for 6" and 8" wafers said Vic Hejmadi. USI utilizes its Semiconductor process technology, infrastructure and expertise by providing our customers with Made-In-America products that are cost effective, and reliable said Vic Hejmadi.

Universal Semiconductor is a private company founded in 1978, and is headquartered in a custom-built class 10/1000 plant located in the heart of Silicon Valley, San Jose, CA. The facility contains R &D, design engineering, custom and semi custom wafer fabrication, production test, prototype fabrication, sales and marketing.

USI offers a wide and diverse patented technology mix that have been designed to operate on the same chip: Analog/Digital; High Voltage Smart Power; CMOS, DMOS; Bipolar: RC/D Arrays, RF FETs, Photodiode, and Solar Cell.