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The custom molded ingot support beams are used to mount silicon and various semiconductor and photovoltaic materials in preparation of inside diameter and wire saw wafering. The mounting beams are used in conjunction with the patented VALTRON® ingot mounting adhesive system to obtain optimal performance.

Various Sizes, Shapes & Compositions

• Products for BOTH Wire Saws & Annular Slicing Processes
• Self-dressing Composite for Inside Diameter Saws
• ISO 9001 Manufacturing
  

SLICING BEAMS

Valtech Corporation manufactures slicing beams that hold crystalline ingots during the wafering process. These mounting substrates are used in both annular saw and wire saw processes.

Annular Slicing
The patented VALTRON® "Clean Beam" is a unique mounting substrate containing a small amount of abrasive. The abrasive lightly dresses and cleans the ID blade with each slice allowing the slicing process to remain very stable. The "Clean Beam" is precision molded and offers several advantages over conventional graphite mounting substrates including:

• Improved dimensional stability
• Ideal surface conditions
• Cleaner handling characteristics

Many different sizes and shapes of the "Clean Beam" are available. Currently ingots ranging from 50mm to 500mm can be accommodated.

Wire Saw Slicing
Valtech Corporation manufactures mounting substrates for the wire saw process that offer an alternative to the conventional graphite substrates. The "Clean Beam" is inherently electrically insulating which eliminates the need for a glass insulator plate between the mounting substrate and the saw fixture. The use of the "Clean Beam" results in increased throughput and lower costs. The manufacturing process involves precision molding, in-line blasting and thorough quality control procedures. The "Clean Beam" for wire saw slicing is available in many different types of configurations and will accommodate ingot ranging in diameter from 50mm to 500mm. Custom configurations are also manufactured based on specific customer requirements.