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Valtech Corporation manufactures two component epoxy adhesives used in the semiconductor and photovoltaic industry for ingot slicing applications.

• Various Bond Strength Formulations
• Short & Long Term Cure
• Medium & High Viscosity Products
• Various Packaging Configurations
• Unique Patented Formulations
• ISO 9001 Manufacturing Certification

Epoxy Adhesives

Valtech Corporation specializes in the development and manufacture of epoxy adhesive systems used in the semiconductor and photovoltaic wafering process. These products are utilized in both the annular and wire slicing processes.

Annular Slicing
VALTRON® epoxies are designed specifically for the annular slicing process. Unique components are incorporated into product formulations to reduce the amount of stress occurring between the crystalline material and the epoxy. This reduction in stress results in a decrease in the amount of exit chips that occur during slicing. These epoxies are also designed to prevent loading onto the annular saw and will eliminate saw marks and increase saw blade life.

Wire Slicing
Valtech Corporation has developed several adhesive products designed specifically for the wire slicing process. These quick curing adhesive systems were developed to maximize production throughput. The removal of these epoxy systems is easily accomplished with a heated detergent solution eliminating the need for aggressive acids and solvents.

Packaging
The VALTRON® Epoxy Adhesives are available in a variety of packaging configurations including:
5 gallon steel pails
One Gallon steel cans
Pre-Measured MixPacs Syringes