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Valtech Corporation - Heat-Release Adhesives for Temporary Bonding

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Valtech Corporation has developed a unique adhesive system designed specifically for temporary bonding applications that offer significant advantages in the processing of solar ingots. The AD4000 series adhesives are two-component epoxies having excellent adhesion characteristics when cured and are easily released from the bonded surfaces by exposing the adhesive to 90°C (194°F). Once exposed to the elevated temperature, the adhesive system completely detaches from the bonded surfaces leaving no films or residues on the bonded materials.

These unique adhesive products have proven successful in a number of applications including polishing, lapping, machining and wire sawing. A variety of formulations are available catering to different processing requiremements. A single component ultra-violet curing system is also available.

Avalilable Systems

Resin : Hardener Application

AD4010-A : AD4015-B Standard Heat Release System

AD4010-A : AD4017-B Increased Gel Time

AD4110-A : AD4015-B Reduced Viscosity System

AD4180-A : AD4180-B Non-Sagging System for Vertical Surface Bonding

AD0950 : Single Component, UV Curing System

This unique adhesive system is available in a variety of packaging configurations including convenient cartridge systems to allow for easy applicaiton.

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