The InSightTM 3D Atomic Force Microscope (AFM) provides unparalleled accuracy and precision required for non-destructive, high-resolution 3D measurements of critical 45nm and 32nm semiconductor features.
Veeco's new Insight 3DAFM provides the lowest measurement uncertainty (TMU) for critical dimension (CD), depth and sidewall angle (SWA) metrology, which directly leads to improved process control.
- Lowest CD, SWA and depth TMU of any in-line metrology tool
- Unique, non-destructive, 3D metrology (LER, LWR, SWA)
- 30 wph, 9 sites throughput for depth metrology
- 12 wph, 9 sites throughput for CD metrology
- Production level reliability and automation
- Provides fast time to data and speeds development time
- Provides in-line 3D metrology for Gate to improve process control
The InSight 3DAFM provides production-based Reference Metrology on crucial CD elements encountered in lithography and advanced etch processing, including gate, shallow trench isolation (STI), dual-damascene structures, sidewalls line-edge variation and reference metrology.
Application Notes
- In Line Monitoring of Shallow Trench Isolation Divot Depth (AN99) [PDF]
- 3D Atomic Force Microscopy as an Alternative to X-SEM and TEM for Advanced Process Metrology[PDF]
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