Veeco's third-generation, large-format surface profiling system provides unprecedented measurement performance and capability on substrate panels, bumped substrates, flat panels, and circuit boards. The SP9900 incorporates over 10 years of packaging and panel measurement experience to deliver the best precision, speed, reliability, serviceability and manufacturing readiness for 3D critical dimension measurements in large-format applications. Every feature of the SP9900 has been engineered for production convenience, ease of use, and reliability, from its fast image processing and operator-friendly interface to its customizable recipes and field-proven advanced automation.
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