Thickness and Bow of all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and sapphire or tape

The Proforma 300i wafer thickness gage is a capacitance based, differential measurement system that performs non-contact thickness measurements of semiconducting and semi-insulating wafers. By utilizing MTI Push/Pull technology, the Proforma 300i does not require the wafers to have a consistent electrical ground resulting in exceptional accuracy and repeatability for most wafer types. The Proforma 300i system includes full remote control operating software and Ethernet network interface capability.

Features

• Front USB port enables easy data storage to flash drives
• MTI Instruments' Proprietary Capacitance Circuitry for Outstanding Accuracy and Dependability
• Non-contact Measurements
• 76-300 mm Diameter Wafer Range
• Optional wafer measurement rings
• Wafer stops for exact centering
• Ethernet interface
• Full remote control software (Windows compatible)
• Optional calibration wafers

Download brochure.