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Non-Contact Wafer Thickness Gage The Proforma 300 TM Advantage: "One package for all wafer sizes and materials" Based on MTI's proprietary capacitance technology, the Proforma 300 TM can be used on all wafer materials including: silicon gallium-arsenide indium phosphide germanium ... without recalibrating or electrically grounding the wafer! Fast, accurate, and reliable, the Proforma 300 TM measures wafers up to 300 mm in diameter for both thickness and total thickness variation (TTV) Portable and easy to set up, the Proforma 300 TM provides the user precise non-contact measurements at critical points throughout the wafer manufacturing process.

Designed to meet the stringent requirements of wafer measurements in a production environment Thickness and TTV values are obtained by placing the wafer between MTI's non-contact capacitance probes. The Teflon coated wafer stage allows for easy, non-abrasive positioning of the wafer, while removable locating pins can be utilized for precise center thickness measurements. Thickness and TTV values are indicated on the high resolution LCD display. An RS-232 port is provided for output to a personal computer, while a parallel port provides direct output to a printer. The ProformaTM 300 is completely menu-driven. The on-board intelligence provides fast, accurate, repeatable measurements for all types of wafer materials. Maximum measurement range or maximum probe/wafer stand-off distance can also be adjusted to meet your specific requirements. Menu-driven for fast, easy setup Proprietary Push-Pull TM probe technology High-resolution LCD display On-board microprocessor for accurate, repeatable measurements Bubble level Adjustable stage for precise leveling Teflon wafer stage for easy, non-abrasive positioning Measurements: Thickness Total thickness variation (TTV) Continuous and 5-point measurement Advantages: Measures different materials, such as Si, Ge, InP, and GaAs, without recalibration No need to electrically ground the wafer Easy to set up and operate - making it ideal for production and statistical process control (SPC) Provides high performance at low cost Can be customized for maximum sensing range or maximum stand-off from target

Features: MTI's proprietary capacitance circuitry for outstanding accuracy and dependability Non-contact measurements 50-300 mm diameter wafer range +/-0.25 µm accuracy RS-232 output port to PC Parallel port for printer

Applications: Slicing saw set-up Thickness TTV Degradation monitoring Wire guide re-grooving Blade replacement Lap/etch and polishing Process monitoring TTV Material removal Final inspection Lot sampling Final thickness