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Product Announcements: Thermoset Adhesives
11 Browse Product Announcements

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Product Announcements 1 - 2 of 2
Master Bond, Inc. - Snap Cure-Conductive Adhesive Performs Up To 400°F
Snap Cure-Conductive Adhesive Performs Up To 400°F

Master Bond Supreme10HTFS is a, 2 minute, rapid curing and electrically conductive silver filled epoxy. It features tensile shear strengths of 1,200 psi, T-peel strengths in excess of 5 pli, and volume resistivity less than 10-3 ohm-cm. Service temperatures are from 4°K up to 205°C with superior resistance to impact, thermal shock, vibration ,creep and corrosion. (read more)

More product announcements from Master Bond, Inc.
Valtech Corporation - Epoxy Adhesives for Ingot Slicing Applications
Epoxy Adhesives for Ingot Slicing Applications

Valtech Corporation manufactures two component epoxy adhesives used in the semiconductor and photovoltaic industry for ingot slicing applications. (read more)

More product announcements from Valtech Corporation
 
 
View Thermoset Adhesives datasheets.



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