H.C. Starck Inc. - Fabricated Products Group

. The reliability and efficiency of semiconductor devices can be improved by maximizing the thermal conductivity of the heat dissipating components, while matching their coefficients of thermal expansion (CTE) to those of the substrates. We use finite element modeling as a computational tool to develop customized products for special applications that require effective heat removal under extreme conditions. Our advanced modeling capability enables us to address the needs of our customers... Read more...

More Product Announcements from H.C. Starck Inc. - Fabricated Products Group