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New technologies that increase productivity, improve quality, and lower costs across the wire and cable industry.
PA&E

We combine titanium and Mo/Cu heat shinks for lightweight hermetic electronic packages with low-coefficient of thermal expansion (CTE), and high thermal conductivity - ideal for handling the heat created by gallium arsenide electronic circuitry. Read more...

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PA&E

Our hermetic electronic packaging and connector technology can deliver all three. Using unique materials (like explosively bonded metals) and manufacturing processes, we build integrated electronic packaging that deliver maximum performance in smaller footprints at lighter weights. Read more...

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PA&E

Need to optimize your RF/Microwave electronic package for size, weight or CTE? At PA&E, our unique composite metal RF/Microwave connector construction allows you to integrate high-performance RF connectors into lightweight (aluminum) or low CTE (titanium) electronic packging. Read more...

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PA&E

Why risk your mission-critical system on a solder joint that is prone to failure after repeated thermal cycling? At PA&E, we integrate our RF or DC connectors into Ti or Al electronic housings via laser welding for maximum reliability. Read more...

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HUBER+SUHNER AG

In a world where performance, speed and density matter, our MXP multicoax solution is the perfect fit. The small form factor and outstanding electrical characteristics combined with reliable mating and ease of use make our MXP an excellent solution for bench-top and system testing. MXP can also be used as an interconnect within automated semiconductor test equipment. Read more...

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HUBER+SUHNER AG

The SMPM-T is the smallest threaded open source connector on the market. Its unique and innovative combination of a MIL-STD-348 SMPM female interface connector together with a retractable threaded nut provides an integrated solution offering unprecedented electrical and mechanical performance. The SMPM-T handles high density requirements with a connector centerline-to-centerline spacing... Read more...

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HUBER+SUHNER AG

Innovative fiber optic interface - Q-XCO from HUBER+SUHNER AG.

The new Q-XCO SFP connector is mated in one step and is the interface with the best installation safety. Read more...

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Carlisle Interconnect Technologies

Carlisle Interconnect Technologies has advanced the design of the traditional push-on connector with our new line of SMP-L connectors by adding a patent-pending locking mechanism, referred to as Secure-Lok™, to the standard SMP interface. Read more...

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Carlisle Interconnect Technologies

HDRFI® (High Density RF Interconnect) is a patented CarlisleIT connection system that transfers high frequency signals through a unique planar interface. Read more...

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Carlisle Interconnect Technologies

Carlisle Interconnect Technologies is your reliable resource for high-performance RF/microwave connectors designed for military/aerospace, instrumentation and wireless infrastructure markets. Read more...

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