Product Announcements: Edge Connectors

The DIGI-KLIP SRP series of free-standing card edge contacts employs Components Corporation's proven wire form technology, reliably applied in electronic packaging designs since 1962. SRP contacts are formed from high grade, beryllium copper alloy wire and heat treated for optimum spring temper after forming. (read more)

The DIGI-KLIP® DRP series of dual readout, free-standing card edge connectors represents a major advancement in packaging technology for the reliable mating of printed circuit boards. At the heart of the DRP design is Components Corporation's proven wire form contact principle, a patented contact system successfully applied in single readout formats since 1962. (read more)

Schuster Electronics introduces a new line of stacked headers and plugs from Phoenix Contact that provide a higher density application than previously available in a European-style terminal block. (read more)

Interplex's SMT Card-Edge contacts can be placed on a daughter card using standard high-speed pick and place surface mount equipment. The Surface Mount Device (SMD) solder interface utilizes pin in paste through-hole technology as well as recessed channels for improved solder distribution which allows for high mechanical strength at the point of connection. (read more)

Interplex's SMT Card-Edge contacts can be placed on a daughter card using standard high-speed pick and place surface mount equipment. The Surface Mount Device (SMD) solder interface utilizes pin in paste through-hole technology as well as recessed channels for improved solder distribution which allows for high mechanical strength at the point of connection. (read more)

*female or male*assembly type or molding type*3pin~8pin (read more)

Samtec's expanded line of high speed edge card solutions include a new high density socket featuring a bi-level mating design. Schuster Electronics offers their BEC5 Series High Density Edge Card Socket, ideal for high-speed applications. Samtec's Edge Rate™ Contacts are designed for superior impedance control and reduced broadside coupling. (read more)

Samtec has expanded its line of high speed edge card solutions to include a new high density socket featuring a bi-level mating design, two levels of contacts on a staggered 1mm (.0394") centerline, which creates a card effective 0,5mm (.0197") pitch. (read more)

Samtec's 0,8mm pitch High Speed Edge Card Sockets are ideal for many high speed micro backplane applications, offering excellent performance in a cost-efficient one-piece, direct card-to-board design. (read more)

The compact Powerclaw® connectors are rated at 55 amps for single pole and 50 amps for multipole connections and are available in straight and right angle versions. Powerclaw contacts are shipped in ESD packaging for prevention of potential electrostatic charges. (read more)