Advanced Interconnections Corp.

BGA, LGA, or QFP to QFP footprint on the PCB

Advanced's patented Solder Sphere Interface streamlines package conversion for use on PC boards with existing QFP pads. Our Adapters and Interposers are custom designed to convert BGA, LGA, or other device packages to an existing QFP footprint or QFP to QFP with the same or different footprint. Read more...

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Interplex Industries, Inc.

Interplex's application specific solutions for the packaging of IGBT power modules and complete power stack assemblies utilizing several proven core high-force, high-power, pluggable interconnect technologies, such as press-fit, IDC (Insulation Displacement Connectors), tuning forks and other products to improve power module packaging efficiency. Read more...

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Aries Electronics, Inc.

Aries Electronics - SOWIC-to-DIP Adapter – Series 35W000, RoHS/WEEE-Compliant 14- to 28-Pin.

  • Lead-Free RoHS/WEEE-Compliant
  • A cost-effective means of upgrading to SOIC without changing your PCB layout
  • Available on 0.300 [7.62] centers
  • For Adapters on 0.400 [10.16], or 0.600 [15.24] centers, consult Data Sheet 18011
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Aries Electronics, Inc.

Aries Electronics - RoHS/WEEE-Compliant SOIC-to-DIP Adapter – Series 350000-11-RC

  • A cost-effective means of upgrading to SOIC without changing your PCB layout
  • Available on 0.300 [7.62] centers
  • For Adapters on 0.400 [10.16] or 0.600 [15.24] centers, consult
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Aries Electronics, Inc.

Aries Electronics - Low-Cost, Quick Turn Small Outline Prototyping Adapter.

  • Mates SOT23, SOIC, MSOP, or TSSOP packages to standard breadboard and breakout boards for rapid and easy prototyping
  • Panelized adapters available upon request
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Aries Electronics, Inc.

Aries Electronics - RoHS/WEEE-Compliant 14- to 28-Pin SOWIC-to-DIP Adapter, Series 35W000

  • Lead-Free RoHS/WEEE-Compliant
  • A cost-effective means of upgrading to SOIC without changing your PCB layout
  • Available on 0.300 [7.62] centers
  • For Adapters on 0.400 [10.16], or 0.600 [15.24] centers, consult Data Sheet 1...
Read more...

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Aries Electronics, Inc.

Reduce high-density interconnect (HDI) construction by adapting smaller pitch devices to larger footprints. Convert 0.4mm and 0.5mm pitch footprints to 1mm or 1.27mm pitch. Read more...

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Aries Electronics, Inc.

Aries Electronics - High-Temperature SOIC-to-DIP Adapter – Series 350000-10-HT

  • A cost-effective means of upgrading to SOIC without changing your PCB layout
  • Available on 0.300 [7.62] centers
  • For Adapters on 0.400 [10.16], or 0.600 [15.24] centers, consult Data Sheet 18011
Read more...

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Aries Electronics, Inc.

Aries Electronics - DIP-to-SOIC Adapter – Series 354000

Convenient, cost-effective means of converting DIP-style packaging to SOIC PC board layouts. Read more...

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Aries Electronics, Inc.

Aries Electronics - 14 to 28 Pins SOWIC-to-DIP Adapter – Series 35W000

  • A cost-effective means of upgrading to SOIC without changing your PCB layout
  • Available on 0.300 [7.62] centers
  • For Adapters on 0.400 [10.16] or 0.600 [15.24] centers, consult Data Sheet 18011
Read more...

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