BGA, LGA, or QFP to QFP footprint on the PCB
Advanced's patented Solder Sphere Interface streamlines package conversion for use on PC boards with existing QFP pads. Our Adapters and Interposers are custom designed to convert BGA, LGA, or other device packages to an existing QFP footprint or QFP to QFP with the same or different footprint. Read more...More Product Announcements from Advanced Interconnections Corp.
Interplex's application specific solutions for the packaging of IGBT power modules and complete power stack assemblies utilizing several proven core high-force, high-power, pluggable interconnect technologies, such as press-fit, IDC (Insulation Displacement Connectors), tuning forks and other products to improve power module packaging efficiency. Read more...More Product Announcements from Interplex Industries, Inc.
Rectangular Type Adapters for .050" (1.27mm) Pitch SOIC devices. Standard and lead-free designs featuring screw-machined terminals. Read more...More Product Announcements from Advanced Interconnections Corp.
Interplex Engineered Products (IEP) is a turnkey vertically integrated world-class supplier of application specific open cavity thermoplastic semi-conductor and Electronic Packages across all major markets. Read more...More Product Announcements from Interplex Industries, Inc.