Aries Electronics, Inc.

For Test & Burn-In of CSP, µBGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP, SOIC, LGA, LCC, PLCC, TO and any SMT package style made. Also can be compatible with PGA packaged devices. Read more...

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Aries Electronics, Inc.

Adjacent and/or opposing pins are interconnected until the pre-slotted section is programmed out. An almost infinite number of programs can be attained by merely leaving or removing interconnecting sections. Read more...

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Aries Electronics, Inc.

High-Temp (up to 250°C) Universal DIP ZIF Burn-in & Test Sockets (300°C special order). Accepts devices on 0.300 to 0.600 [7.62 to 15.24] centers in packages from 24- thru 48-pin Read more...

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Rego Electronics Inc.

SD (Secure Digital) Card is a non-volatile memory card format for portable devices such as mobile phones, digital cameras, GPS navigation devices, and tablet computers. The three form factors are original size, mini size, and micro size. Our portfolio contains both the standard type and reverse type with push-push, push-pull and hinge versions. Read more...

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Advanced Interconnections Corp.

Peel-A-Way® Removable Terminal Carriers offer ultimate design flexibility and a simple, economical method for automated pin loading. Read more...

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IRISO U.S.A., Inc.

Iriso creates custom IC Sockets and Headers that closely match our customers' needs... Read more...

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Advanced Interconnections Corp.

Our screw-machined Pin Grid Array (PGA) Sockets and Adapters come in a multitude of footprints, including interstitial, and can be custom-engineered to meet specific requirements. PGA Sockets provide a cost-effective method for replacing, repairing, or upgrading PGA devices in the field. Read more...

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Advanced Interconnections Corp.

Peel-A-Way® Removable Socket Terminal Carriers from Advanced Interconnections. Peel-A-Way® products are a low profile, lightweight alternative to traditional, molded dual inline sockets. The high temperature carrier can be easily removed after processing for complete solder joint visibility and improved air flow. Read more...

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Advanced Interconnections Corp.

Flip-Top™ BGA Test Sockets from Advanced Interconnections Corp. simplfy testing and validation of BGA and LGA devices, saving space on the board and speeding the test process. Watch our new video to see how easy it is to use. Read more...

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Advanced Interconnections Corp.

Peel-A-Way® DIP Socket Terminal Carriers from Advanced are a low profile, lightweight alternative to traditional, molded dual inline sockets. The high temperature carrier can be easily removed after processing for complete solder joint visibility and improved air flow. Read more...

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View IC Sockets and Headers datasheets.