Aries Electronics, Inc.

Aries Electronics - Horizontal Display DIP Sockets for DIP packaging of LEDs, incandescent lamps, DIP switches, test points, etc.. Variations of mounting position and pin configuration provide exceptional design freedom. Read more...

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Aries Electronics, Inc.

Aries Electronics - Accepts standard LEDs and incandescent displays as well as 0.500" [21.70mm] and 0.600" [15.24mm] high large displays. Read more...

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Aries Electronics, Inc.

Aries Electronics - SOIC and SOJ-to-DIP Adapter

  • A cost-effective means of upgrading to SOJ or SOIC without changing your PCB layout
  • Available on 0.300 [7.62] centers
  • For adapters on 0.400 [10.16], or 0.600 [15.24] centers.
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Aries Electronics, Inc.

Adjacent and/or opposing pins are interconnected until the pre-slotted section is programmed out. An almost infinite number of programs can be attained by merely leaving or removing interconnecting sections. Read more...

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Aries Electronics, Inc.

Aries Electronics - RoHS/WEEE-Compliant DIP-to-SOIC Adapter– Series 354000

A lead-free RoHS/WEEE-compliant cost-effective adapter to upgrade DIP-to-SOIC on 0.300" [7.62] centers without changing your PCB layout Read more...

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Aries Electronics, Inc.

High-Temp (up to 250°C) Universal DIP ZIF Burn-in & Test Sockets (300°C special order). Accepts devices on 0.300 to 0.600 [7.62 to 15.24] centers in packages from 24- thru 48-pin Read more...

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Aries Electronics, Inc.

Aries Electronics - unique universal socketing system allows the socket to be easily configured for any package. For Test & Burn-In of CSP, µBGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP, SOIC, LGA, LCC, PLCC, TO and any SMT package style made. Also can be compatible with PGA packaged devices. Read more...

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Mill-Max Mfg. Corp.

The new 406 series SMT socket strip from Mill-Max is ideal for socketing leaded IC devices on SMT boards and for low profile board stacking applications. The connector is dual row, .100” (2,54 mm) pitch, accepts standard IC leads and when used in combination with SMT or through-hole headers, provides a reliable interconnect solution. Read more...

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Mill-Max Mfg. Corp.

With a board-to-board stack height measuring less than 0.3” (7,62mm), the gull wing series is ideal for tight, compact spaces in which a surface mount, precision-machined connector is the preferred design choice. In addition, the diameter of the leads – .014” (0,36mm) for the socket, .015” (0,38mm) for the header – leaves a tiny footprint, saving valuable PC... Read more...

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Mill-Max Mfg. Corp.

Mill-Max introduces our lowest profile spring-loaded connectors, just .100” in height. The trend toward miniaturization in electronic packaging demands ever smaller interconnects that deliver high quality performance. For board-to-board or device-to-board connections, these low profile spring-loaded connectors are a practical solution. Read more...

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