Richardson RFPD

Liquid cooling is typically used in applications where desired performance can no longer be economically met by air cooling due to thermal and/or footprint requirements. There are many ways to accomplish liquid cooling, but the most common method is to have a plate with a flow path that moves liquid under the device that is dissipating heat. After the heat is absorbed into the liquid, it... Read more...

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Richardson RFPD

Wakefield-Vette's extruded heat sinks from Richardson RFPD provide a greater range of natural convection soutions for higher power components and systems. Complex fin structures can be created by forcing raw aluminum through an extrusion die. These complex fin profiles allow greater heat dissipation through increased surface area while eliminating the cost and time associated with machin... Read more...

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MINTEQ® International Inc, Pyrogenics Group

HT pyrolytic graphite thermal spreaders and vias provides engineers high
purity (>99.999%) and lightweight (2.25 g/cc) spreader options with exceptional
thermal performance. Read more...

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MINTEQ® International Inc, Pyrogenics Group

With heat issues limiting power device performance and growth, we have developed a derivative of our material branded as Pyroid® HT Pyrolytic Graphite material that offers heat spreaders and sink thermal conductivity up to 4 times (1700 W/m°K) that of copper at only a quarter of the weight. Read more...

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CUI Inc.

CUI’s Thermal Management Groupannounced an expansion to its existing portfolio of Peltier devices and dc fans with the addition of a heat sink product line. The new line of aluminum heat sinks, available in both extruded and stamped versions, is compatible with TO-218, TO-220, TO-252, and TO-263 transistor packages. Designed to improve the heat dissipation of low and high power boa... Read more...

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Ohmite Manufacturing Co.

M series patented (Pat. No. 7,151,669), high performance, low cost, configurable, scalable and compact heat sink with matrix clip system for TO-247 and TO-264 packages. This powerful heat sink provides the easiest assembly, largest surface area and smallest footprint. Read more...

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Ohmite Manufacturing Co.

Ohmite D Series heatsinks provide an innovative solution for SMT compatible semiconductors and resistors. The unique design (Patent Pending) combines tin plated, solderable rods with an aluminum extruded heat sink body. Read more...

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Mersen

Mersen announces the release of R-Tools GEN III, the next generation of its completely re-designed interactive 3D Thermal Heatsink Modeling simulation software for power electronics applications. Read more...

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