M series patented (Pat. No. 7,151,669), high performance, low cost, configurable, scalable and compact heat sink with matrix clip system for TO-247 and TO-264 packages. This powerful heat sink provides the easiest assembly, largest surface area and smallest footprint. Read more...More Product Announcements from Ohmite Manufacturing Co.
Ohmite D Series heatsinks provide an innovative solution for SMT compatible semiconductors and resistors. The unique design (Patent Pending) combines tin plated, solderable rods with an aluminum extruded heat sink body. Read more...More Product Announcements from Ohmite Manufacturing Co.
Performance and convenience are offered in this comprehensive line of thermal solutions for DC-DC converters. With fin ratios over 14:1 on some models, these heat sinks deliver extreme thermal performance. For convenience, all our heat sinks are ready for mounting with interface material pre-applied which streamlines procurement and assembly. Read more...More Product Announcements from bisco industries
See Pyroid HT Heat Spreading Ability In Action - Compare it to Aluminum and Copper Read more...More Product Announcements from MINTEQ® International Inc, Pyrogenics Group
Ohmite introduces this new versatile heatsink design. This new design can accommodate several different industry packages. This design also lets the customer choose a mounting style using screws or clips for secure mounting to the heatsink.
These one of a kind heatsinks are offered in a vertical (free convection cooling) or horizontal format (forced convection cooling) to fit cust... Read more...More Product Announcements from Ohmite Manufacturing Co.
Rego Electronics Inc., we offer customized heat sinks such as CNC machining, stamping, skived and die casting heat sinks. We have a strong technical thermal team and equipment to precisely measure the performance. Please contact us directly and get a prompt reply! Read more...More Product Announcements from Rego Electronics Inc.
A properly designed vapor chamber with heat sink can improve the thermal performance by 10- 30% over copper, and heat pipe based solutions. A vapor chamber is much lighter than solid copper, due to its internal chamber structure. In many cases, a vapor chamber based heat sink weighs the same as an extruded aluminum heat sink, but works much better than a copper heat sink. Read more...More Product Announcements from Rego Electronics Inc.
Extruded heat sinks are the most cost-effective cooling solutions. Extrusion is a manufacturing process to create objects of a fixed cross-sectional profile. A material is pushed or drawn through a die of the desired cross-section. They are the most commonly used heat sinks in thermal management. 6063-T5 aluminum alloy is frequently used. Read more...More Product Announcements from Rego Electronics Inc.
Forging is a manufacturing process involving metal shaping by localized compressive forces. Rego's Precision Forge Technology is capable to produce both aluminum and copper heat sinks. Read more...More Product Announcements from Rego Electronics Inc.