bisco industries

Performance and convenience are offered in this comprehensive line of thermal solutions for DC-DC converters. With fin ratios over 14:1 on some models, these heat sinks deliver extreme thermal performance. For convenience, all our heat sinks are ready for mounting with interface material pre-applied which streamlines procurement and assembly. Read more...

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Tanfel

Tanfel is a leading distributor specializing in custom metal parts. Our combination of world class manufacturing partners coupled with exceptional logistics and customer service support, work with you from prototype to large production. Read more...

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Mouser Electronics, Inc.

Advanced Thermal Solutions (ATS) maxiGRIP™ Star LED Heatsinks provide engineers a base heatsink platform to create custom LED heatsink solutions. ATS maxiGRIP Star LED Heatsinks deliver aluminum heatsink extrusions designed for high heat flux round or star shaped LED elements. The heatsink material is AL-6063 anodized aluminum for maximum thermal performance. SUBSCRIP... Read more...

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Mouser Electronics, Inc.

Advanced Thermal Solutions (ATS) fanSINK™ Heatsinks feature omnidirectional air flow for optimum thermal performance independent of PCB layout. ATS fanSINK™ Heatsinks ensure dependable long-term fan to heatsink assembly with stainless screw fan attachments. The heatsink is attached with ATS maxiGRIP™ hardware avoiding the need for PCB mounting holes. Includes pre-assemb... Read more...

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Mouser Electronics, Inc.

Advanced Thermal Solutions (ATS) Freescale BGA heatsinks are designed for Freescale flip-chip ICs.ATS Freescale BGA heatsinks offer MaxiGRIP™ attachment which applies steady, even pressure to the component and does not require holes in the PCB. The heatsink comes preassembled with high performance phase changing thermal interface material for ease of installation. SUB... Read more...

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Mouser Electronics, Inc.

Advanced Thermal Solutions (ATS) maxiFLOW™ heatsink design features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. ATS maxiFLOW™ heatsink features 3 attachment methods, maxiGRIP™, thermal tape, or pushpin. MaxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the... Read more...

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